IR2200 Microscope System
IR2200 Infrared Microscope (NIR to SWIR)
This infrared microscope allows users to inspect from the frontside and backside. Inspections include cracks, dust, lamination, electrical discharge machining damage, and electrostatic discharge damage through glass or silicon samples. The Seiwa Insight software provides subsurface measurements, XY stitching, 3D topography, autofocus, extended exposure, and image capture for analysis. This system also offers visible to infrared inspection by simply switching optics and filters.
SPECIFICATIONS
WAVELENGTH
ILLUMINATION
FILTER
TURRET
STAGE/FOCUS MOUNT
ES-111 Motorized Stage: size 305mm X 241mm, Travel Range: 125mm X 75mm
H-116 Motorized Stage: size 4478mm X 442mm, Travel Range: 255mm X 215mm
Manual Stage: size 125mm X 125mm, Travel Range: 25mm X 25mm.”
SEIWA INSIGHT SOFTWARE PACKAGE, INCLUDE COMPUTER
OBJECTIVE LENSES
PEIR Plan Series
PEIR Plan HRS Series
CAMERAS
G-032
G-033
G-130
1800 U-030 VSWIR
ARTCAM-990SWIR-TEC
ILLUMINATION
Intensity from 400 to 1700nm
KEY FEATURES
- Auto Extend Field (Stitching)
- Auto Extend Focus (3D Stitching, 3D Topography)
- Auto Extend Exposure
- Auto Focus
- Capture Images
- Measurement
It is suitable for stitching for tilted sample.
SEIWA INSIGHT SOFTWARE
SOFTWARE
Seiwa Insight software offers a comprehensive and advanced suite of features while maintaining an intuitive and user-friendly interface. It enables users to capture images, exercise XYZ-axis control, perform diverse measurements, and efficiently collect data. Additionally, the software incorporates a histogram feature for convenient contrast adjustment.
SEIWA INSIGHT FEATURE
- Measurements and annotations can be used to determine dimensions, area, radius, diameter, and perimeter. Additionally, annotations and notes can be easily added to an image for analysis with team members.
- The Still Image tab allows for capturing single-shot images, cropping to preview regions, inserting a calibration bar, and conveniently saving pictures to a specified file location.
- XY stitching is available for both manual and motorized systems. Additionally, the extended focus and extended exposure functions allow for the creation of a single, in-focus image from multiple depths and exposures by combining various layers.
Objective Lens Options
PEIR Plan Series
• No focal shift between 800nm and 1600nm
• High transmission, long working distance
• Available in 1X, 2.5X, 10X, 20X, 50X, and 100X
• LCD and Silicon corrected versions are available
Application includes
• Wafer Backside Inspection
• Photo Emission Detection
• Laser Repair
• Laser Glass Cutting
• Laser Scan Microscopy
• CARS Microscopy
| Model | Size | Travel Range |
|---|---|---|
| IR2200-ES111 ( AUTOMATED SYSTEM ) | 305MM X 241MM | 125MM X 75MM |
| IR2200-H116 ( AUTOMATED SYSTEM ) | 478MM X 442MM | 255MM X 215MM |
| IR2200-MN (MANUAL SYSTEM ) | 125MM X 125 MM | 25MM X 25MM |
