Mask Aligner
The system enables high resolution exposure, because the system has an auto-alignment function for both top and back surface of wafer, and has three modes in exposure process, proximity, hard contact and soft contact mode.
Mask Aligner
- High-accuracy alignment for both top and back surfaces by a high-resolution objective lens
- High-accuracy paralleling mechanism (Wafer to Mask)
- Precise pressure control for the mask contact
- Auto wafer transportation and auto-alignment
- Precise gap control by laser beam sensor
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